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  • 产品名称: IGBT Power Module AlSiC Heat Dissipation Substrate

The thermal expansion coefficient of AlSiC is very close to that of the common substrate materials (such as AlN or Al2O3), which is conducive to the thermal stability of IGBT high-power modules. In addition, the density of AlSiC is only 1/3 that of copper, so it is the best choice for heat dissipation baseboards.